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 CYStech Electronics Corp.
N-Channel Logic Level Enhancement Mode Power MOSFET
Spec. No. : C730Q8 Issued Date : 2009.07.02 Revised Date : Page No. : 1/8
MTB12N03Q8
Description
BVDSS ID RDSON(max)
30V 12A 11.5m
The MTB12N03Q8 is a N-channel enhancement-mode MOSFET, providing the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost effectiveness. The SOP-8 package is universally preferred for all commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters.
Features
* Single Drive Requirement * Low On-resistance * Fast Switching Characteristic * Dynamic dv/dt rating * Repetitive Avalanche Rated * Pb-free Lead Plating and Halogen-free package
Symbol
MTB12N03Q8
Outline
SOP-8 Pin 1
GGate DDrain SSource
MTB12N03Q8
CYStek Product Specification
CYStech Electronics Corp.
Absolute Maximum Ratings (Ta=25C)
Parameter Symbol
Spec. No. : C730Q8 Issued Date : 2009.07.02 Revised Date : Page No. : 2/8
Limits
Unit
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current @ TC=25C Continuous Drain Current @ TC=100C Pulsed Drain Current Avalanche Current Avalanche Energy @ L=0.1mH, ID=12A, RG=25 Repetitive Avalanche Energy @ L=0.05mH TA=25 Total Power Dissipation TA=100 Operating Junction and Storage Temperature Range
VDS VGS ID IDM IAS EAS EAR PD Tj, Tstg
30 20 12 10 48 *1 12 7.2 3.6 *2 3 *3 1.5 -55~+175
V
A
mJ W C
100% UIS testing in condition of VD=15V, L=0.1mH, VG=10V, IL=15A, Rated VDS=25V N-CH
Thermal Data
Parameter Thermal Resistance, Junction-to-case, max Thermal Resistance, Junction-to-ambient, max Symbol Rth,j-c Rth,j-a Value 25 50 *3 Unit C/W C/W
Note : 1. Pulse width limited by maximum junction temperature 2. Duty cycle1% 3. Surface mounted on 1 in copper pad of FR-4 board, 125C/W when mounted on minimum copper pad
Characteristics (TC=25C, unless otherwise specified)
Symbol Static BVDSS VGS(th) GFS IGSS IDSS ID(ON) RDS(ON) Dynamic Ciss Coss Crss
MTB12N03Q8
Min. 30 1 12 -
Typ. 1.7 15 9.7 14.5 1060 190 145
Max. 3 100 1 25 11.5 18 -
Unit V V S nA A A m m
Test Conditions VGS=0, ID=250A VDS = VGS, ID=250A VDS =5V, ID=12A VGS=20 VDS =24V, VGS =0 VDS =20V, VGS =0, TJ=125C VDS =5V, VGS =10V VGS =10V, ID=12A VGS =4.5V, ID=10A
*1
*1 *1
pF
VGS=0V, VDS=15V, f=1MHz
CYStek Product Specification
CYStech Electronics Corp.
Characteristics (TC=25C, unless otherwise specified)
Symbol Qg (VGS=10V) *1, 2 Qg (VGS=4.5V) *1, 2 Qgs *1, 2 Qgd *1, 2 td(ON) *1, 2 tr *1, 2 td(OFF) *1, 2 tf *1, 2 Rg Source-Drain Diode IS *1 ISM *3 VSD *1 trr Qrr Min. Typ. 12 4.5 1.2 3.7 8 6 24 3 2 18 10 Max. 2.5 10 1.2 Unit nC Test Conditions
Spec. No. : C730Q8 Issued Date : 2009.07.02 Revised Date : Page No. : 3/8
VDS=15V, VGS=10V, ID=12A
ns
VDS=15V, ID=1A, VGS=10V, RGS=2.7 VGS=15mV, VDS=0V, f=1MHz
A
V ns nC
IF=IS, VGS=0V IF=IS, dIF/dt=100A/s
Note : *1.Pulse Test : Pulse Width 300s, Duty Cycle2% *2.Independent of operating temperature *3.Pulse width limited by maximum junction temperature.
Ordering Information
Device MTB12N03Q8 Package SOP-8 (Pb-free & Halogen-free package) Shipping 2500 pcs / Tape & Reel Marking B12N03
MTB12N03Q8
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Spec. No. : C730Q8 Issued Date : 2009.07.02 Revised Date : Page No. : 4/8
MTB12N03Q8
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves(Cont.)
Spec. No. : C730Q8 Issued Date : 2009.07.02 Revised Date : Page No. : 5/8
MTB12N03Q8
CYStek Product Specification
CYStech Electronics Corp.
Reel Dimension
Spec. No. : C730Q8 Issued Date : 2009.07.02 Revised Date : Page No. : 6/8
Carrier Tape Dimension
MTB12N03Q8
CYStek Product Specification
CYStech Electronics Corp.
Recommended wave soldering condition
Product Pb-free devices Peak Temperature 260 +0/-5 C
Spec. No. : C730Q8 Issued Date : 2009.07.02 Revised Date : Page No. : 7/8
Soldering Time 5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature Average ramp-up rate (Tsmax to Tp) Preheat -Temperature Min(TS min) -Temperature Max(TS max) -Time(ts min to ts max) Time maintained above: -Temperature (TL) - Time (tL) Peak Temperature(TP) Time within 5C of actual peak temperature(tp) Ramp down rate Time 25 C to peak temperature
Sn-Pb eutectic Assembly 3C/second max. 100C 150C 60-120 seconds 183C 60-150 seconds 240 +0/-5 C 10-30 seconds 6C/second max. 6 minutes max.
Pb-free Assembly 3C/second max. 150C 200C 60-180 seconds 217C 60-150 seconds 260 +0/-5 C 20-40 seconds 6C/second max. 8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
MTB12N03Q8
CYStek Product Specification
CYStech Electronics Corp.
SOP-8 Dimension
Top View A Right side View G
Spec. No. : C730Q8 Issued Date : 2009.07.02 Revised Date : Page No. : 8/8
Marking:
I B C H
Device Name Date Code
J D Front View
Part A
E
Part A
K L N O
8-Lead SOP-8 Plastic Package CYStek Package Code: Q8
M
F
*: Typical
DIM A B C D E F G H
Inches Min. Max. 0.1850 0.2007 0.1457 0.1614 0.2283 0.2441 0.0500* 0.0130 0.0201 0.1472 0.1527 0.0472 0.0638 0.1889 0.2007
Millimeters Min. Max. 4.70 5.10 3.70 4.10 5.80 6.20 1.27* 0.33 0.51 3.74 3.88 1.20 1.62 4.80 5.10
DIM I J K L M N O
Inches Min. Max. 0.0031 0.0110 0.0157 0.0323 0.0074 0.0102 0.0145 0.0204 0.0118 0.0197 0.0031 0.0051 0.0000 0.0059
Millimeters Min. Max. 0.08 0.28 0.40 0.83 0.19 0.26 0.37 0.52 0.30 0.50 0.08 0.13 0.00 0.15
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
* Lead: pure tin plated * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTB12N03Q8
CYStek Product Specification


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